Original: $54.38
-65%$54.38
$19.03The Story
Tetric N-Bond Universal is a single-component, light-cured adhesive for direct and indirect bonding procedures and all etching protocols[1]. It is the only universal bonding agent available in the efficient VivaPen delivery form.
Users of Tetric N-Bond Universal are delighted by the new, innovative and user-friendly VivaPen delivery form, which provides up to four times more applications per ml compared with conventional bottles[2-4]. Tetric N-Bond Universal offers reliably high adhesion values and the included desensitising effect ensures minimal risk of postoperative sensitivities[5].
Convince yourself of the benefits of the user-friendly VivaPen. Its pen-like design and bendable tip allow you to apply the adhesive quickly and effectively directly in the patient's mouth[6]. It does not have to be predispensed into a mixing well.
- Simple application protocol: fast and controlled application directly in the patient's mouth
- Precise dispensing due to the improved "click" mechanism
- Reliable high bond strength (> 25 MPa) on enamel and dentin irrespective of the etching protocol used or the moisture conditions on the tooth surface
- Minimised risk of postoperative sensitivity under dry and wet conditions
Uncompromising quality
- Predictable high bond strength (> 25 MPa) on enamel and dentin
- Integrated desensitizing effect that minimizes the risk of postoperative sensitivity
Outstanding esthetics- Since Tetric N-Bond Universal can be applied very thinly, you have all the freedom you need to create esthetically demanding restorations
- Low film thickness (approx. 10 μm) after light-curing ensures a precise fit when cementing indirect restorations
Efficiency down the line- Efficient dispensing with the VivaPen: up to four times more applications per ml compared with conventional bottles
- 187 single-tooth applications with 1 VivaPen
- Quick and reliable light-curing in just 5 seconds (with a light intensity of 2000 mW/cm2)
- Universal application: for direct and indirect bonding procedures and all etching protocols
Description
Tetric N-Bond Universal is a single-component, light-cured adhesive for direct and indirect bonding procedures and all etching protocols[1]. It is the only universal bonding agent available in the efficient VivaPen delivery form.
Users of Tetric N-Bond Universal are delighted by the new, innovative and user-friendly VivaPen delivery form, which provides up to four times more applications per ml compared with conventional bottles[2-4]. Tetric N-Bond Universal offers reliably high adhesion values and the included desensitising effect ensures minimal risk of postoperative sensitivities[5].
Convince yourself of the benefits of the user-friendly VivaPen. Its pen-like design and bendable tip allow you to apply the adhesive quickly and effectively directly in the patient's mouth[6]. It does not have to be predispensed into a mixing well.
- Simple application protocol: fast and controlled application directly in the patient's mouth
- Precise dispensing due to the improved "click" mechanism
- Reliable high bond strength (> 25 MPa) on enamel and dentin irrespective of the etching protocol used or the moisture conditions on the tooth surface
- Minimised risk of postoperative sensitivity under dry and wet conditions
Uncompromising quality
- Predictable high bond strength (> 25 MPa) on enamel and dentin
- Integrated desensitizing effect that minimizes the risk of postoperative sensitivity
Outstanding esthetics- Since Tetric N-Bond Universal can be applied very thinly, you have all the freedom you need to create esthetically demanding restorations
- Low film thickness (approx. 10 μm) after light-curing ensures a precise fit when cementing indirect restorations
Efficiency down the line- Efficient dispensing with the VivaPen: up to four times more applications per ml compared with conventional bottles
- 187 single-tooth applications with 1 VivaPen
- Quick and reliable light-curing in just 5 seconds (with a light intensity of 2000 mW/cm2)
- Universal application: for direct and indirect bonding procedures and all etching protocols
